PECSOL has experts with more than 6000 Man hours of rich knowledge of complete Embedded hardware design from Customer requirement, Architectural design, component selection, schematic capture, Board power estimation/calculation, RTL coding, verification, Layout co-ordination, Integrity/Analysis co-ordination, PCB Fab co-ordination, Component procurement, PCBA co-ordination, Board bring up, Testing/Debugging, Integration and Environmental testing to Delivery.

Expertise in following technologies:

- DDR2, DDR3 , LPDDR, RLDRAM, SRAM, SDRAM,
- PCIe, SRIO, SATA, USB3.0,SERDES
- IDE/ATA, PCI, PCIX, PCMCIA,RapidIO
- NOR Flash, NAND Flash, EEPROM, PROM
- Compact Flash, MMC, SD, MicroSD
- Fast Ethernet, Gigabit Ethernet, XUAI
- VGA, DVI, HDMI, LCD Interface
- UART, I2C, I2S, SPI, QSPI, RS485, RS422, SMBus, SDIO
- JTAG 1553B, ARINC429
- cPCI, VPX, VME, XMC, PMC, FMC

Expertise in following Architectures:

FPGA – Xilinx, Altera, Lattice, Microsemi
ARM – 9, 11, CortexA15
DSP – TMS320 series
Intel – 8051, X86
Texas Instrument – OMAP, DM644X
Freescale – PowerPC, i.MX51
Microchip – PICMicrel – KSZ9692, KS8695, KSZ8692

Mixed Signal Design

- Analog to Digital Converters
- Digital to Analog Converters
- Op-amps
- Current Sensing Circuits
- Voltage Sensing Circuits
-Temperature Sensing Circuits
- Proximity Sensors
- Accelerometers
- BJT and FET circuits
- Diodes, Transorbs, Isolators,
- EMI/EMC Filters
- Motor Drivers

PECSOL experts have more than 40,500 man hours of Complex Designs
Having expertise in the following:
- Digital design
- High speed design
- Analog design
- Mixed signal design
- RF design
- Power supply design

Complex designs with 0.37mm Pitch BGA, 2mil track and 2 mil spacing Efficient process flow synchronized with: - Electrical design team
- Mechanical design team
- Simulation team
- Integrity team
- Analysis team


Complex design technologies with : - Up to 48 layers
- Up to 280X300mm Board area
- Board Thickness from 0.35 mm to 5.4 mm
- Copper Thickness from 0.5oZ to 3oZ
- Blind, Buried and Normal Via’s
- ENG and HASL Finish
- Flexi and Rigid PCB’s
- Gerber files generation as per customer requirements

Signal Integrity

Experience in multi point and multi drop bus archietecture.Co-ordination for layer stackup and layout constraints.
Following specifications are evaluated
- Drive Strength
-Eye Diagram
Timing Budget
-Jitter performance
-Termination Methods
-Bit error rate / IR Loss
-Noise/cross talk Figures
-Logical voltage domains
-Slew rate and propagations constraints
-Expertise in handling data rate upto 28 Gbps
Types of Interfaces proficiency
-DDR2, DDR3, RLDRAM, SRAM, Mobile-RAM, LPDDR
-FLASH Memories
-SATA, PCIe, SRIO, USB3.0, SERDES
-Gigabit Ethernet, XUAI

Complex designs with 0.37mm Pitch BGA, 2mil track and 2 mil spacing Efficient process flow synchronized with: - Electrical design team
- Mechanical design team
- Simulation team
- Integrity team
- Analysis team

Power Integrity

- Simulation of IC's switching noise
- Temperature rise simulation wrt PI
- Analysis of Voltage drop and Current Density
- PDN impedance profile validation with S,Y and Z parameters
- Modeling of Plane's for power handling and Noise propagation

EMI / EMC

Proficiency in Board level, Unit level, Sub system and System level EMI Analysis
Reports generation for different National / International standards like CE, UL, FCC, custom standards, etc as per customer requirements
Radiation/Conductive Emision and
Radiation/Conductive Suseptance analysis as per Mil-STD-461F
3D Plots generation for characterstics like Magnetic, Electric and current

Thermal Analysis

Hot spot identification for Components and PCB
Suggesting board temperature impact solutions
Suggesting Heat sink and cooling methodologies
Analysis of single, double and multi layered PCB with Metal / non metal cores
Analysis of Heat transfer mechanism including convection,conduction and radiation.

Mechanical Designs

- Mechanical Designs

Mechanical Structural Analysis

Structural Analysis

PECSOL experts have more than 35,000 man hours of FPGA / RTL design experience
Having experience in FPGA’s like:
- Xilinx – Spartan, Vertex, ZYNQ, Artix, Kintex
- Altera – Stratix, Arria, Cyclone, Stratix 10
- Lattice – MXO, MXO2, MXO3
- Microsemi – ProASIC, AX2000
Having Experience in coding language VHDL and Verilog
Soft IP experience like :
- DDR, DDR2, DDR3
- SDRAM
- Flash controller
- PCIe, SERDES
- Microblaze, ZYNQ, NIOS
- UART, I2C, SPI, GPIO
- ADC / DAC interface

We deliver Power Solutions
-From Milli Watt to KiloWatt.
-With LDO and Switching regulator architecture.
-With single or multi output.